3D Solder Paste Inspection SPI
3D solder paste inspection based on white-light sine stripe PMP technology;
Solder paste height inspection accuracy reaches 1 um;
Auto-restore pad 3D data on PCB surface, calculate the volume, area, height and deviation of every solder paste.
Multi-direction,muti- angle 3D PMP inspection.
Viwid and easy to used graphic interaction interface. comprehensive function and easy to handle;
In addition to programming with Gerber file. image-oriented edit mode can also realize ff-line progr amming and debugging.
Multi Crass *section 3D Height Analysis.
Multi-touch function can realize 3D image rotation and 2D image resizing, convenient ta check and confirm solder paste condition
Comprehensives SPC function includes many kind of diagrams generation and output;
lmage accelerate calculations base on multi-GPU;
Integrated. cast. iron. frame structure, high rigidity can avold outside vibration interference.